6.774 Physics of Microfabrication: Front End Processing
Presents advanced physical models and practical aspects of front-end microfabrication processes, such as oxidation, diffusion, ion implantation, chemical vapor deposition, atomic layer deposition, etching, and epitaxy. Covers topics relevant to CMOS, bipolar, and optoelectronic device fabrication, including high k gate dielectrics, gate etching, implant-damage enhanced diffusion, advanced metrology, stress effects on oxidation, non-planar and nanowire device fabrication, SiGe and fabrication of process-induced strained Si. Exposure to CMOS process integration concepts, and impacts of processing on device characteristics. Students use modern process simulation tools.
This class has 6.152 as a prerequisite.
This class counts for a total of 12 credits. This is a graduate-level class.
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