6.774 Physics of Microfabrication: Front End Processing


Class Info

Presents advanced physical models and practical aspects of front-end microfabrication processes, such as oxidation, diffusion, ion implantation, chemical vapor deposition, atomic layer deposition, etching, and epitaxy. Covers topics relevant to CMOS, bipolar, and optoelectronic device fabrication, including high k gate dielectrics, gate etching, implant-damage enhanced diffusion, advanced metrology, stress effects on oxidation, non-planar and nanowire device fabrication, SiGe and fabrication of process-induced strained Si. Exposure to CMOS process integration concepts, and impacts of processing on device characteristics. Students use modern process simulation tools.

This class has 6.152 as a prerequisite.

6.774 will be offered this semester (Fall 2017). It is instructed by J. L. Hoyt and L. R. Reif.

This class counts for a total of 12 credits.

In the Fall 2013 Subject Evaluations, 6.774 was rated 6.2 out of 7.0. You can find more information on MIT OpenCourseWare at the Physics of Microfabrication: Front End Processing site or on the 6.774 Stellar site.

MIT 6.774 Physics of Microfabrication: Front End Processing Related Textbooks
MIT 6.774 Physics of Microfabrication: Front End Processing On The Web
Physics of Microfabrication: Front End Processing
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